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Process Engineer in Hillsboro
Intel Retiree Medical Plan Trust
Module Development Engineer - Cmp
5+ years semiconductor industry experienceBachelors degree in stem fieldHands-on process tuning and characterization$133,800.00-255,200.00 usd py
Engineers within Intel's Logic Technology Development organization are chartered with continuing to meet the challenge of Moore's Law in the 21st century
Hillsboro, Oregon, USHybridFull time+5y experienceJob Match ScoreCreate Profile
56 days agoIntel Retiree Medical Plan Trust
Wla Yield Defect Metrology Engineer - Shift 5
Bachelor's or master's degree in stem field2+ years metrology experience with bachelor'sStatistical analysis and data visualization skills$99,030.00-139,810.00 usd py
This role plays a pivotal part in driving yield enhancements across Intel's advanced process and packaging technologies
Hillsboro, Oregon, USFull time+2y experienceJob Match ScoreCreate Profile56 days agoApplied Materials
Process Support Engineer Iii - Ald
Bachelor's degree in engineering or related field4-7 years experience in semiconductor fabStrong interpersonal and communication skills$108,000.00 - $148,500.00 py
You will play a critical role in guiding products through their entire lifecycle from initial concept to final qualification
Hillsboro, OR, USFull time+7y experienceJob Match ScoreCreate Profile60 days agoIntel
Module Development Engineer
Semiconductor processing and fabrication experienceMaterials science or chemical engineering degreeAdvanced transistor device structures knowledge$133,800.00-255,200.00 usd py
TD Module Development Engineers lead scientific research to enable the manufacture of innovative device architectures for high volume manufacturing
Hillsboro, Oregon, USOn-siteFull time+4y experienceJob Match ScoreCreate Profile62 days agoIntel
Advanced Packaging Td Plating Module Engineer
Electrochemical plating processing experienceFab process development expertiseStatistical process control knowledge$155,520.00-219,550.00 usd py
This role leads the plating process development and optimization for Intel's advanced packaging technology roadmap
Hillsboro, Oregon, USOnsiteFull time+6y experienceJob Match ScoreCreate Profile62 days agoIntel
Intel Foundry Module Development Engineer
Master's degree with 5+ years experiencePhd with 1+ years experienceHands-on experimental research in stem$133,800.00-255,200.00 usd py
This position is in the Intel Foundry team working in one of the most advanced semiconductor process technologies in the world
Hillsboro, Oregon, USHybridFull time+5y experienceJob Match ScoreCreate Profile62 days agoIntel
Process Integration Development Engineer
Transmission electron microscopy operationPhd or ms in materials science physics chemistry3+ years related experience$115,110.00-219,550.00 usd py
The position involves characterizing semiconductor nano-devices using advanced transmission electron microscopy to expand analytical capabilities for Intel's Foundry labs
Hillsboro, Oregon, USOn-siteFull time+3y experienceJob Match ScoreCreate Profile62 days agoIntel
Module Development Engineer - Cmp
Chemical mechanical planarization process developmentSemiconductor processing and fabrication experienceMaterials science or chemical engineering background$133,800.00-255,200.00 usd py
Engineers within Intel's Logic Technology Development organization are chartered with continuing to meet the challenge of Moore's Law in the 21st century
Hillsboro, Oregon, USHybridFull time+5y experienceJob Match ScoreCreate Profile62 days agoApplied Materials
Module Process Engineer Iii - (e3)
Metal deposition process experienceWafer fab background requiredPvd cvd ald knowledge$96,000.00 - $132,000.00 py
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world
Hillsboro, OR, USNot specifiedFull time+4y experienceJob Match ScoreCreate Profile65 days agoIntel Corporation
Advanced Packaging Td Plating Module Engineer
Electrochemical plating processing experienceFab process development expertiseStatistical process control knowledge$155,520.00-219,550.00 usd py
This role leads the plating process development, optimizing equipment solutions and material selection for Intel's advanced packaging technology
Hillsboro, Oregon, USFull time+6y experienceJob Match ScoreCreate Profile66 days agoIntel Retiree Medical Plan Trust
Advanced Packaging Td Plating Module Engineer
Electrochemical plating processing experienceFab process development expertiseStatistical process control knowledge$155,520.00-219,550.00 usd py
This role leads the plating process development and optimization for Intel's advanced packaging technology, driving both high-volume manufacturing and future technology enablement
Hillsboro, Oregon, USFull time+6y experienceJob Match ScoreCreate Profile66 days agoIntel
Process Integration And Development Engineer
Ph.d. in electrical engineering or related fieldExperience with semiconductor reliability mechanismsKnowledge of dielectric and interconnect reliability$115,110.00-219,550.00 usd py
This role focuses on defining integrated process solutions and conducting experiments aimed at enhancing semiconductor device quality, reliability, and manufacturability
Hillsboro, Oregon, USOn-siteFull timeExperience requiredJob Match ScoreCreate Profile66 days agoIntel
Process Integration And Development Engineer
Ph.d. in electrical engineering or related fieldExperience with semiconductor reliability mechanismsExperience in semiconductor device fabrication$115,110.00-219,550.00 usd py
Join Intel as a Process Integration Development Engineer to shape the future of semiconductor technology through cutting-edge process development
Hillsboro, Oregon, USFull timeExperience requiredJob Match ScoreCreate Profile67 days agoIntel
Advanced Packaging Td Plating Module Engineer
Electrochemical plating processing experienceMaster's degree in stem disciplineStatistical process control methodology$155,520.00-219,550.00 usd py
This role leads the plating process development and optimization for Intel's advanced packaging technology to drive high-volume manufacturing
Hillsboro, Oregon, USFull time+6y experienceJob Match ScoreCreate Profile67 days agoIntel
Module Development Engineer - Cmp
Chemical mechanical planarization process developmentSemiconductor processing and fabrication experienceMaterials science or related stem degree$133,800.00-255,200.00 usd py
Engineers in the Logic Technology Development organization are tasked with continuing Moore's Law by innovating leading-edge fabrication processes
Hillsboro, Oregon, USFull time+5y experienceJob Match ScoreCreate Profile67 days agoIntel
Module Development Engineer - Cmp
Chemical mechanical planarization process developmentSemiconductor processing and fabrication experienceMaterials science or chemical engineering background$133,800.00-255,200.00 usd py
Engineers within Intel's Logic Technology Development organization are chartered with continuing to meet the challenge of Moore's Law in the 21st century
Hillsboro, Oregon, USFull time+5y experienceJob Match ScoreCreate Profile67 days agoIntel
Process Integration And Development Engineer
Ph.d. in electrical engineering or related fieldExperience with semiconductor reliability mechanismsExperience in semiconductor device fabrication$115,110.00-219,550.00 usd py
This role focuses on defining integrated process solutions and conducting experiments aimed at enhancing semiconductor device quality and reliability
Hillsboro, Oregon, USOn-siteFull timeExperience requiredJob Match ScoreCreate Profile67 days agoIntel Corporation
Module Development Engineer - Cmp
Chemical mechanical planarization process developmentSemiconductor processing and fabrication experienceMaterials science or chemical engineering background$133,800.00-255,200.00 usd py
Engineers within Intel's Logic Technology Development organization are chartered with continuing to meet the challenge of Moore's Law in the 21st century
Hillsboro, Oregon, USHybridFull time+5y experienceJob Match ScoreCreate Profile69 days agoQorvo Inc
Principal Process Engineer
Gaas technology thin filmsCompound semiconductor technologiesThin films deposition~$115,110 – $255,200 py
WORKOPIA ESTIMATEQorvo has an opening for a GaAs Technology Thin Films Principal Process Engineer at our Hillsboro, Oregon facility
Hillsboro, OR, USOn-site+12y experienceJob Match ScoreCreate Profile70 days agoHITACHI HIGH-TECH AMERICA, INC.
Process Engineer I-iv
Process development and optimizationPlasma etch process engineeringSemiconductor manufacturing processes$64,811.80 - $146,963.71 annually py
The Process Engineer I - IV position supports the business objectives of HTA’s Semiconductor Equipment Division (SED) related to sales of Reactive Ion Etch (RIE or Plasma Etch) equipment to the semiconductor industry
Hillsboro, OR, US+3y experienceJob Match ScoreCreate Profile73 days agoAsm
Senior Engineer I, Field Process
Ald, peald, pecvd, epitaxy, lpcvd processesThin film processing and characterizationDoe and statistical experiment design~$115,110 – $255,200 py
WORKOPIA ESTIMATEDevelop, optimize, and transfer innovative ALD, PEALD, PECVD, Epitaxy, and LPCVD processes at customer sites
Hillsboro, Oregon, USOn-siteExperience requiredJob Match ScoreCreate Profile81 days agoASM
Principal Field Process Engineer
Technical authority and escalation ownerCustomer-facing process applicationsAdvanced deposition processes and hardware~$115,110 – $255,200 py
WORKOPIA ESTIMATEOwn technical delivery and escalation for NPI of advanced deposition processes and hardware (thermal ALD, plasma ALD, Area Selective Deposition)
Hillsboro, Oregon, USOn-site+10y experienceJob Match ScoreCreate Profile93 days agoAsm
Senior Engineer I, Field Process, Ald
Ald, peald, pecvd, epitaxy, lpcvd processesNew product introduction (npi) supportCustomer-facing technical link~$115,110 – $255,200 py
WORKOPIA ESTIMATEAs a Snr. Field Process Engineer, you will help expand ASM’s advanced film technologies at our customer’s Oregon site by developing, optimizing, and transferring innovative ALD, PEALD, PECVD, Epitaxy, and LPCVD processes
Hillsboro, Oregon, USOn-site+4y experienceJob Match ScoreCreate Profile93 days ago
WORKOPIA ESTIMATE is shown when an employer doesn't disclose pay. It's the typical range (25th–75th percentile) of disclosed salaries for the same role in the same city, adjusted for seniority and refreshed daily — an estimate, not the employer's figure.
