Module Process Engineer Iii - (e3)

Applied Materials

Hillsboro, OR, US
Base: $96,000.00 - $132,000.00; bonus/equity: elig...
Not specified
Metal deposition process experience
Wafer fab background required
Pvd cvd ald knowledge
Applied Materials is seeking a Module Process Engineer III to support its semiconductor and display manufacturing operations in Hillsboro, OR. The ideal candidate will have experience with metal deposition technologies and a background in wafer fabrication, along with a commitment to problem-solving and customer engagement

Job Summary

  • Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.
  • The role involves using process and hardware knowledge to understand tool performance, resolve complex issues, and deliver service products to customers.
  • Candidates will benefit from a supportive work culture that encourages learning, development, and career growth while pushing the boundaries of technology.

Matching Summary

Match Score: 85

Applied Materials is seeking a Module Process Engineer III to support its semiconductor and display manufacturing operations in Hillsboro, OR. The ideal candidate will have experience with metal deposition technologies and a background in wafer fabrication, along with a commitment to problem-solving and customer engagement.

Salary

Base: $96,000.00 - $132,000.00; Bonus/Equity: Eligible for bonus and stock award program; Benefits: Comprehensive benefits package including health and wellbeing programs

Skills & Requirements

Must-have

  • Metal deposition process experience
  • Wafer Fab background required
  • PVD CVD ALD knowledge
  • Systematic troubleshooting methodology
  • Customer roadmap interpretation

Nice-to-have

  • Supportive work culture
  • Cross-functional collaboration skills
  • Innovative problem solving mindset
  • Strong communication abilities
  • Career growth opportunities

Key Requirements

  • BS in Engineering Physics or Chemistry
  • 2-4 years metal deposition process experience
  • Wafer Fab equipment experience
  • Knowledge of 1-2 unit processes

Work Rights

Not specified

Tailored Resume

Cover Letter