Advanced Packaging Td Plating Module Engineer

Intel Corporation

Hillsboro, Oregon, United States
Base: $155,520.00-219,550.00 usd; bonus/equity: st...
Electrochemical plating processing experience
Fab process development expertise
Statistical process control knowledge
This role leads the plating process development, optimizing equipment solutions and material selection for Intel's advanced packaging technology

Job Summary

  • This role leads the plating process development, optimizing equipment solutions and material selection for Intel's advanced packaging technology.
  • Candidates will drive technology roadmaps and collaborate with cross-functional teams to enable cutting-edge device architectures.
  • The position offers a competitive compensation package including stock bonuses and comprehensive health and retirement benefits.

Matching Summary

This role leads the plating process development, optimizing equipment solutions and material selection for Intel's advanced packaging technology.

Salary

Base: $155,520.00-219,550.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, vacation

Skills & Requirements

Must-have

  • Electrochemical Plating processing experience
  • Fab process development expertise
  • Statistical process control knowledge
  • Master's degree in STEM discipline
  • 6+ years relevant engineering experience

Nice-to-have

  • RDL-based packaging experience
  • Ultra-fine pitch solder connections
  • Leading programs to high-volume production
  • Strong collaboration with decision-makers
  • Innovative process development capability

Key Requirements

  • Master's degree with 6+ years experience or PhD with 4+ years
  • 3+ years in electroplating or advanced packaging
  • STEM background in Materials, Mechanical, Electrical, Chemical Engineering, Chemistry, or Physics

Work Rights

Not specified

Tailored Resume

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