Staff Signal Integrity & Power Integrity Engineer (si/pi)

Cerebras Systems

Sunnyvale, CA, United States
Base: $225,000 to $275,000 annually; bonus/equity:...
On-site
High-speed serial and parallel interface analysis
Pcb, rigid-flex, and flex circuit stack-up design
Advanced si/pi analysis of flex connectors
Solve complex signal integrity and power integrity problems for high‑speed AI compute platforms, including chip‑to‑chip and chip‑to‑board interfaces

Job Summary

  • Solve complex signal integrity and power integrity problems for high‑speed AI compute platforms, including chip‑to‑chip and chip‑to‑board interfaces.
  • Lead root‑cause analysis of challenging SI/PI issues such as margin shortfalls, impedance discontinuities, coupling, resonances, and simulation‑to‑hardware mismatches.
  • Define and refine PCB, rigid‑flex, and flex circuit stack‑ups, material selections, and impedance structures as required to meet performance targets.

Matching Summary

Solve complex signal integrity and power integrity problems for high‑speed AI compute platforms, including chip‑to‑chip and chip‑to‑board interfaces.

Salary

Base: $225,000 to $275,000 annually; Bonus/Equity: May include bonus and equity; Benefits: Not specified

Skills & Requirements

Must-have

  • high-speed serial and parallel interface analysis
  • PCB, rigid-flex, and flex circuit stack-up design
  • advanced SI/PI analysis of flex connectors
  • 2D and 3D electromagnetic simulation tools
  • power delivery network analysis and simulation
  • correlate simulation results with hardware behavior

Nice-to-have

  • large-scale AI systems experience
  • high-performance compute systems experience

Key Requirements

  • Master’s degree in Electrical Engineering
  • Demonstrated depth of expertise in SI/PI engineering
  • Deep expertise in high-speed serial and parallel interface analysis
  • Strong hands-on experience with PCB, rigid-flex, and flex circuit stack-up design
  • Advanced SI/PI analysis of flex connectors, high-density interconnects, and advanced packaging technologies
  • Proficiency with 2D and 3D electromagnetic simulation tools
  • Power delivery network analysis, simulation, and lab correlation
  • Strong grounding in transmission line theory, microwave engineering, and high-speed design fundamentals
  • Proven ability to correlate simulation results with hardware behavior

Work Rights

Not specified

Tailored Resume

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