Sr. Staff Engineer, Package Engineering

Marvell Technology

Tw
5-7 years of experience
Flip-chip package development
Basic cadence apd skills
The package engineering team drives semiconductor package development from concept to mass production

Job Summary

  • The package engineering team drives semiconductor package development from concept to mass production.
  • There is the excitement of always working on new projects and cutting-edge technologies.
  • Marvell is dedicated to giving our people the tools and resources they need to succeed.

Matching Summary

The package engineering team drives semiconductor package development from concept to mass production.

Skills & Requirements

Must-have

  • 5-7 years of experience
  • Flip-chip package development
  • Basic Cadence APD skills

Nice-to-have

  • Good program management skills
  • OSAT management experience
  • Good communication skills

Key Requirements

  • Bachelor’s degree in Mechanical Engineering
  • 3-5 years of experience with semiconductor packaging
  • Understanding of semiconductor technologies

Work Rights

Not specified

Tailored Resume

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