Advanced Packaging Flagship Curriculum Internship Program

Intel Foundry

Kulim, Malaysia
On-site
Undergraduate student status
Advanced packaging flagship curriculum completion
Usm academic plan requirement
The Advanced Packaging Flagship Curriculum Internship Program at Intel Foundry in Kulim, Malaysia, offers undergraduate students the opportunity to engage in hands-on experience in semiconductor manufacturing processes. Interns will collaborate with engineering teams to optimize assembly processes while gaining exposure to diverse packaging technologies

Job Summary

  • This internship offers hands-on experience in advanced packaging technology manufacturing modules including MIHL, TCB, and SLAM.
  • The role supports the development and implementation of assembly processes while collaborating with engineering teams to optimize process control.
  • Participants will gain industrial exposure and technical skills that enhance their future career prospects within Intel's global foundry network.

Matching Summary

Match Score: 85

The Advanced Packaging Flagship Curriculum Internship Program at Intel Foundry in Kulim, Malaysia, offers undergraduate students the opportunity to engage in hands-on experience in semiconductor manufacturing processes. Interns will collaborate with engineering teams to optimize assembly processes while gaining exposure to diverse packaging technologies.

Skills & Requirements

Must-have

  • Undergraduate student status
  • Advanced Packaging Flagship Curriculum completion
  • USM academic plan requirement
  • On-site presence in Malaysia

Nice-to-have

  • Interest in package assembly processes
  • Experience with lasermark and inspection
  • Knowledge of thermal compression bonding
  • Collaborative engineering environment

Key Requirements

  • Must be an undergraduate student
  • Must have completed Advanced Packaging Flagship Curriculum
  • Must follow USM academic plan for internship
  • Must be available for on-site work in Kulim, Malaysia

Work Rights

Not specified

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