(高雄)客製化記憶體製程整合工程師

winbond

Kaohsiung, Taiwan
Competitive salary based on market; performance bo...
On-site
Master's degree in related field
3+ years of relevant experience
Intermediate english proficiency
Winbond is seeking a Customized Memory Process Integration Engineer for their Kaohsiung office. The ideal candidate will have experience in TSV and interposer technology, along with strong process integration and customer communication skills

Job Summary

  • The role involves developing TSV and Si interposer technologies while managing custom memory process integration and yield improvements for mass production.
  • Candidates must possess strong analytical skills to conduct reliability analysis and verification of processes, modules, and products.
  • The company offers competitive compensation including performance bonuses, comprehensive group insurance, and a generous leave policy exceeding legal standards.

Matching Summary

Match Score: 85

Winbond is seeking a Customized Memory Process Integration Engineer for their Kaohsiung office. The ideal candidate will have experience in TSV and interposer technology, along with strong process integration and customer communication skills.

Salary

Competitive salary based on market; Performance bonuses and profit sharing available; Comprehensive benefits including health insurance and childcare subsidies

Skills & Requirements

Must-have

  • Master's degree in related field
  • 3+ years of relevant experience
  • Intermediate English proficiency

Nice-to-have

  • TSV 3DIC and Interposer development experience
  • Process integrate and defect reduction capabilities
  • WAT test analysis and semiconductor physics knowledge
  • Cu and logic process experience
  • Customer communication and negotiation skills

Key Requirements

  • Master's degree required
  • Minimum 3 years of experience
  • Intermediate English language skills

Work Rights

Not specified

Tailored Resume

Cover Letter