$113,600.00-$151,400.000; not specified; not speci...
Automated wire bonding processes
Process development and optimization
Statistical analysis and doe
The person is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing
Job Summary
The person is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing.
This role supports production readiness, drives continuous improvement, and ensures process capability, repeatability, and compliance with quality and reliability requirements.
We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.
Matching Summary
The person is responsible for developing, optimizing, and sustaining automated wire bonding processes used in microelectronics manufacturing.
Salary
$113,600.00-$151,400.000; Not specified; Not specified