Packaging Module Equipment Development Engineer

Intel Retiree Medical Plan Trust

Phoenix, Arizona, United States
Base: $120,860.00-170,630.00 usd; bonus/equity: st...
Onsite
Phd in materials science or engineering
Minimum gpa of 3.5
Peer-reviewed technical journal publication
The role involves developing advanced packaging technologies including FLI/SLI, thermal solutions, and SMT/PCB technologies for Intel's future platforms

Job Summary

  • The role involves developing advanced packaging technologies including FLI/SLI, thermal solutions, and SMT/PCB technologies for Intel's future platforms.
  • Candidates must possess a PhD with at least one year of experience and a minimum GPA of 3.5 along with a peer-reviewed publication.
  • Intel offers a competitive total compensation package including stock bonuses and comprehensive health and retirement benefits.

Matching Summary

The role involves developing advanced packaging technologies including FLI/SLI, thermal solutions, and SMT/PCB technologies for Intel's future platforms.

Salary

Base: $120,860.00-170,630.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, vacation

Skills & Requirements

Must-have

  • PhD in Materials Science or Engineering
  • Minimum GPA of 3.5
  • Peer-reviewed technical journal publication
  • First Level/Second Level Interconnect development
  • Thermal solutions (TIM1) expertise
  • SMT/PCB technology knowledge
  • Onsite presence required

Nice-to-have

  • Statistical Process Control (SPC) experience
  • Design of Experiments (DOE) familiarity
  • Semiconductor foundry work experience
  • Leading teams in matrixed organizations
  • Tolerance for ambiguity and adaptability
  • Strong communication and influencing skills

Key Requirements

  • PhD degree required prior to start date
  • Minimum 3.5 GPA
  • One peer-reviewed publication
  • US location requirement (Arizona)

Work Rights

Not specified

Tailored Resume

Cover Letter