Advanced Packaging Process Integration Principal/ Staff Engineer
Applied Materials
Singapore, Singapore
Hybrid
7+ years semiconductor processing experience
Cleanroom environment hands-on experience
2.5d/3d advanced packaging process development
This role involves developing integrated process modules for advanced packaging technologies targeting mobile, IoT, consumer, and high-performance computing markets
Job Summary
This role involves developing integrated process modules for advanced packaging technologies targeting mobile, IoT, consumer, and high-performance computing markets.
The successful candidate will conduct gap-analysis, risk-assessment, and integration process flow development to ensure timely project delivery.
Applied Materials offers a supportive work culture that encourages learning, professional growth, and collaboration with globally recognized R&D teams.
Matching Summary
This role involves developing integrated process modules for advanced packaging technologies targeting mobile, IoT, consumer, and high-performance computing markets.
Skills & Requirements
Must-have
7+ years semiconductor processing experience
Cleanroom environment hands-on experience
2.5D/3D advanced packaging process development
Through-Silicon Via (TSV) knowledge
Design of experiment methodology
Wafer lot management and metrology data analysis
Nice-to-have
Knowledge of hybrid bonding technologies
Experience with flip-chip and re-distribution layers
Understanding of high-density interconnects
Ability to drive projects across geographies
Strong communication skills for stakeholder management
Key Requirements
Bachelor, Master, or Doctorate in STEM disciplines
At least 7 years of hands-on experience in semiconductor technology
Deep knowledge of BEOL and Packaging Assembly unit processes