Job Summary

• Join Intel as a Packaging Module Development Engineer for Thermal Compression Bonding module in Advanced Packaging Technology Manufacturing - Technology Development (APTM-TD) team, where you'll play a pivotal role in shaping the future of assembly and packaging technologies.
• Develop and optimize assembly processes and equipment to enable Intel's next-generation packaging technologies, applying statistical methods and principles of design of experiments (DOE) to establish and improve process specifications.
• Collaborate with cross-functional teams to ensure manufacturability and reliability of package designs, documenting technical advancements and improvements through white papers and reports.

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Skills & Requirements

Key Requirements

• Bachelor's degree in STEM field
• Familiarity with semiconductor assembly equipment
• Master's degree with First Class Honors
• Proficiency in statistical methods
• Fundamental understanding of semiconductor devices

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