Design Engineer V - (e5)

Applied Materials

Santa Clara, CA, US
Base: $198,000.00 - $272,500.00; bonus/equity: eli...
Hybrid
Advanced packaging domain expertise
Logic dram nand experience
Materials process device physics
The role involves developing new modules in Advanced Semiconductor Packaging as a member of a global diverse cross functional team

Job Summary

  • The role involves developing new modules in Advanced Semiconductor Packaging as a member of a global diverse cross functional team.
  • Candidates must possess deep understanding of materials, process, device physics, and integration to drive new inflections in logic, DRAM, and NAND.
  • The position offers a competitive salary range of $198,000.00 - $272,500.00 along with comprehensive benefits and stock award programs.

Matching Summary

The role involves developing new modules in Advanced Semiconductor Packaging as a member of a global diverse cross functional team.

Salary

Base: $198,000.00 - $272,500.00; Bonus/Equity: Eligible for bonus and stock award program; Benefits: Comprehensive benefits package including health and wellbeing programs

Skills & Requirements

Must-have

  • Advanced packaging domain expertise
  • Logic DRAM NAND experience
  • Materials process device physics
  • Structured problem-solving methodology
  • Cross-functional team collaboration

Nice-to-have

  • MES systems for Si fab processing
  • Thought leadership in hybrid bonding
  • Innovation and novel approach ideation
  • Strong communication with business units
  • Self-starter working independently

Key Requirements

  • Minimum BS/MS in Engineering or Material Science
  • 5 years experience in advanced packaging
  • Specialization in logic DRAM or NAND sectors

Work Rights

Not specified

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