Smts Integration Engineer - Advanced Packaging Program (2.5d And 3d Heterogeneous Integration)
GlobalFoundries
2.5d and 3d heterogeneous integration
Advanced packaging program leadership
Process development and optimization
Lead our Advanced Packaging Program with a specific focus on 2.5D and 3D heterogeneous integration technologies
Job Summary
Lead our Advanced Packaging Program with a specific focus on 2.5D and 3D heterogeneous integration technologies.
Drive the development and optimization of advanced packaging processes, including interposer design, TSVs, and die stacking.
Foster a collaborative and innovative environment, working closely with R&D, design, and manufacturing teams to integrate new solutions into production.
Matching Summary
Lead our Advanced Packaging Program with a specific focus on 2.5D and 3D heterogeneous integration technologies.
Skills & Requirements
Must-have
2.5D and 3D heterogeneous integration
Advanced Packaging Program leadership
Process development and optimization
Cross-functional team collaboration
Technical documentation and reporting
Nice-to-have
Passion for innovation
Continuous improvement mindset
Adaptability under pressure
Mentorship of junior engineers
Key Requirements
Minimum 10 years semiconductor packaging experience
At least 5 years leadership in 2.5D/3D integration
Bachelor's or Master's degree in relevant engineering field