Packaging Technical Leader

Cisco UK

Base: $168,800 - $241,200 (varies by location); bo...
6+ years semiconductor packaging experience
Expertise in 2.5d/3d tsv mcm flip-chip
Package design architecture knowledge
The role involves driving innovation in advanced packaging technology for Cisco's cutting-edge ASIC and silicon photonic products within a collaborative environment

Job Summary

  • The role involves driving innovation in advanced packaging technology for Cisco's cutting-edge ASIC and silicon photonic products within a collaborative environment.
  • Candidates will partner with top-tier assembly partners and suppliers to develop solutions while influencing commodity strategy at a global scale.
  • Cisco offers competitive compensation including base salary ranges up to $277,400 depending on location, along with comprehensive benefits like equity and flexible vacation.

Matching Summary

The role involves driving innovation in advanced packaging technology for Cisco's cutting-edge ASIC and silicon photonic products within a collaborative environment.

Salary

Base: $168,800 - $241,200 (varies by location); Bonus/Equity: Eligible for annual bonuses and restricted stock units; Benefits: Medical, dental, vision, 401(k), paid time off, and wellness days

Skills & Requirements

Must-have

  • 6+ years semiconductor packaging experience
  • Expertise in 2.5D/3D TSV MCM flip-chip
  • Package design architecture knowledge
  • Physical failure analysis methods
  • Advanced problem-solving methodologies

Nice-to-have

  • Co-packaged optics familiarity
  • Volume manufacturing experience
  • Advanced simulation tools proficiency
  • Global multi-functional team leadership
  • Willingness to evolve professionally

Key Requirements

  • 6+ years progressive industry experience
  • Knowledge of advanced substrate manufacturing processes
  • Experience with statistical process control

Work Rights

Not specified

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