Samsung Austin Semiconductor is seeking an experienced engineer to deliver technical leadership in wafer bonding and de-bonding while ensuring smooth 24/7 operations
Job Summary
Samsung Austin Semiconductor is seeking an experienced engineer to deliver technical leadership in wafer bonding and de-bonding while ensuring smooth 24/7 operations.
The role requires designing experiments, analyzing bonding quality, and collaborating with cross-functional teams to improve yield, reliability, cost, and throughput.
Total compensation includes a competitive base salary range of $70,480-$179,090 along with medical, dental, vision insurance, 401(k) matching, and paid time off.
Matching Summary
Samsung Austin Semiconductor is seeking an experienced engineer to deliver technical leadership in wafer bonding and de-bonding while ensuring smooth 24/7 operations.
Salary
Base: $70,480 - $179,090; Bonus/Equity: MBO bonuses based on performance; Benefits: Medical, dental, vision, 401(k) matching, PTO, wellness incentives
Skills & Requirements
Must-have
Wafer bonding and de-bonding equipment experience
Hybrid bonding techniques knowledge
Preventative maintenance scheduling
FMEA and RPN reduction activity
Clean room environment work capability
Nice-to-have
VBA Python R SQL programming skills
Vendor evaluation and qualification experience
Cross-functional team collaboration
Project management and prioritization
Data analysis and presentation skills
Key Requirements
Bachelor's degree in Engineering or related discipline
Minimum 5 years Fab Equipment management experience
Minimum 3 years wafer bonding equipment experience
Authorized to access US export control information
Work Rights
Must be authorized to access U.S. export control information