Fab Module Engineer

Intel Retiree Medical Plan Trust

Hillsboro, Oregon, US
Base: $76,390.00-107,840.00 usd; bonus/equity: sto...
Hybrid
Equipment and process optimization
Robust manufacturing process module
300mm toolsets
Join us as we create the next generation of technologies that will shape the future for decades to come

Job Summary

  • Join us as we create the next generation of technologies that will shape the future for decades to come.
  • The Wafer Packaging Manufacturing (WPM) organization owns a crucial part of semiconductor wafer processing, testing, and die-to-wafer assembly.
  • We offer competitive salary and financial benefits as well as programs that promote health and well-being.

Matching Summary

Join us as we create the next generation of technologies that will shape the future for decades to come.

Salary

Base: $76,390.00-107,840.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Equipment and process optimization
  • Robust manufacturing process module
  • 300mm toolsets
  • Thick metal/via layers
  • Bumping, reflow, thinning, backside metallization
  • Safety, tool health, process health
  • Excursion prevention and response

Nice-to-have

  • High-performing culture
  • Execution with urgency
  • Personal ownership
  • Data-driven problem solving
  • Thrive in dynamic environments
  • Teamwork and leadership skills
  • Communication and influencing skills

Key Requirements

  • Bachelor's Degree in STEM field
  • Knowledge of statistics and experimental design
  • Strong data analysis and presentation acumen
  • Technical and troubleshooting skills
  • Ability to work across organizational boundaries
  • Excellent teamwork and leadership skills

Work Rights

Not specified

Tailored Resume

Cover Letter