This role offers an opportunity to work at the most advanced semiconductor fab in the United States utilizing leading-edge N4, N3, and N2 process technologies
Job Summary
This role offers an opportunity to work at the most advanced semiconductor fab in the United States utilizing leading-edge N4, N3, and N2 process technologies.
The successful candidate will solve critical equipment issues, improve tool uptime, and install new tool sets for 5-nanometer or beyond equipment according to planned schedules.
TSMC provides a comprehensive benefits program including medical, dental, vision, income-protection programs, and a 401(k)-retirement savings plan.
Matching Summary
This role offers an opportunity to work at the most advanced semiconductor fab in the United States utilizing leading-edge N4, N3, and N2 process technologies.
Skills & Requirements
Must-have
Bachelor's degree in Engineering
2 years engineering experience
5nm technology or beyond experience
Metrology or lithography processing
Optical critical dimension (OCD) experience
Film thickness metrology experience
Mechanical component improvement
Nice-to-have
Strong sense of reliability
Enthusiastic attitude
Cross-functional communication skills
Root cause analysis capability
6-sigma process control knowledge
Key Requirements
Bachelor's degree in Electronics, Electrical, Mechanical, Material Science, Chemical, or Automation Engineering
Minimum 2 years of engineering role experience
At least 1 year experience with 5nm technology or beyond
At least 1 year experience in Metrology, lithography, ALD, CVD, RTP, dry etching, or wet cleaning
At least 1 year experience in 2+ metrology principles (OCD, film thickness, overlay, inspection, CD-SEM, surface scan)
At least 1 year experience in 2+ development areas (mechanical, tooling, machine improvement)
At least 1 year experience in 2+ areas (6-sigma, chemical quality, air/liquid purifier)