Develop and analyze power delivery networks, including 2D and 3D model extraction and noise analysis across die/C4 bumps, silicon, package, sockets, and boards
Job Summary
Develop and analyze power delivery networks, including 2D and 3D model extraction and noise analysis across die/C4 bumps, silicon, package, sockets, and boards.
Perform measurements to characterize power noise profiles across frequency, ground bounce, and other critical metrics, verifying power delivery networks post-design.
Collaborate with silicon integration, die floor planning, and package design teams to optimize on-die decoupling partitions and implement package decoupling schemes.
Matching Summary
Develop and analyze power delivery networks, including 2D and 3D model extraction and noise analysis across die/C4 bumps, silicon, package, sockets, and boards.
Skills & Requirements
Must-have
power delivery networks analysis
2D and 3D model extraction
noise analysis
power grid specifications
electrical characterization tools
hardware architecture fundamentals
Nice-to-have
strong collaboration and communication
disciplined execution
align technical solutions with business goals
Key Requirements
Bachelor's degree in Electrical or Electronic Engineering
2+ years experience electrical design engineer
2+ years experience electrical characterization tools
2+ years experience power integrity design
2+ years experience power and performance analysis