Package Design Manager

SILICON BOX PTE. LTD.

Tampines, Singapore
5-10 years cadence apd experience
Wafer bumping and wlcsp design
Rdl routing and mask design expertise
The role involves leading a packaging design team to generate and update electrical routing layouts based on customer netlists

Job Summary

  • The role involves leading a packaging design team to generate and update electrical routing layouts based on customer netlists.
  • Candidates must possess deep expertise in wafer-level processes including Wafer bumping, WLCSP, BGA, and fan-out technologies.
  • Responsibilities include managing the conversion of internal designs into supplier final designs and supporting audits.

Matching Summary

The role involves leading a packaging design team to generate and update electrical routing layouts based on customer netlists.

Skills & Requirements

Must-have

  • 5-10 years Cadence APD experience
  • Wafer bumping and WLCSP design
  • RDL routing and mask design expertise
  • Fan-out process capability knowledge
  • PCB test board design skills

Nice-to-have

  • Experience with CAM350 and AutoCAD
  • Understanding of product reliability
  • Familiarity with GDS and Gerber editors
  • Link cad software proficiency

Key Requirements

  • 5 to 10 years hands-on experience
  • Proficiency in Cadence APD tool
  • Knowledge of Fan-in/Fan-out processes

Work Rights

Not specified

Tailored Resume

Cover Letter