Advanced Manufacturing Technician

GEHC

Phoenix, United States
Wafer dicing and grinding processes
Advanced troubleshooting skills
Process optimization initiatives
The Dicing/Grinding Technician is responsible for executing and continuously improving wafer dicing and grinding processes

Job Summary

  • The Dicing/Grinding Technician is responsible for executing and continuously improving wafer dicing and grinding processes.
  • This role requires strong technical judgment, advanced troubleshooting skills, and the ability to work with minimal supervision.
  • GE HealthCare offers a great work environment, professional development, challenging careers, and competitive compensation.

Matching Summary

The Dicing/Grinding Technician is responsible for executing and continuously improving wafer dicing and grinding processes.

Skills & Requirements

Must-have

  • wafer dicing and grinding processes
  • advanced troubleshooting skills
  • process optimization initiatives
  • root cause investigations
  • collaborate with engineering
  • EHS regulations adherence

Nice-to-have

  • continuous improvement mindset
  • minimal supervision work ethic
  • technical communication influence
  • staying current with technologies

Key Requirements

  • Associate degree or High School diploma with 3+ years technical experience
  • Demonstrated system-level troubleshooting
  • Interpret test data and diagnose deviations
  • Proficiency in interpreting complex technical information
  • Experience with computerized work systems
  • Proven ability to work independently

Work Rights

Legally authorized to work in the United States

Tailored Resume

Cover Letter