Assembly Engineering Lead

NXP USA INC.

Kaohsiung, Taiwan
On-site
Process standardization
Process capabilities strategy
New technology capability
NXP USA Inc. is seeking an Assembly Engineering Lead in Kaohsiung, Taiwan, responsible for driving process standardization, talent retention, and developing strategies for new capabilities in the semiconductor industry. The ideal candidate should have over 15 years of experience in semiconductor packaging and strong leadership skills

Job Summary

  • Drive process standardization, best practices, and talent retention & growth for organization sustainability.
  • Define, develop and establish process capabilities, strategy and roadmap, and develop a strategy to develop new capabilities or to overcome process constraints.
  • Collaborate with Innovation NPI/NTI team to enable successful NPI/NTI launch with robust Safe Launch closure and attend and own all BCAM related review on NPI/NTI to ensure risk to process margin/manufacturability is mitigated upfront.

Matching Summary

Match Score: 85

NXP USA Inc. is seeking an Assembly Engineering Lead in Kaohsiung, Taiwan, responsible for driving process standardization, talent retention, and developing strategies for new capabilities in the semiconductor industry. The ideal candidate should have over 15 years of experience in semiconductor packaging and strong leadership skills.

Skills & Requirements

Must-have

  • process standardization
  • process capabilities strategy
  • new technology capability
  • risk assessment
  • process flow optimization
  • business continuity
  • equipment benchmarking

Nice-to-have

  • talent retention and growth
  • collaboration with innovation
  • new material suppliers

Key Requirements

  • Bachelor Degree in relevant engineering fields
  • 15+ Years of Experience in Semiconductor industry
  • Experience in running engineering teams
  • Strong leadership skills
  • Excellent logic thinking
  • Excellent data-driven decisions

Work Rights

Not specified

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