The Sr. Manager of Package Design/Development Quality Assurance at Micron Semiconductor Asia Operations is responsible for leading an engineering team to address package technology challenges and ensure product reliability. This role combines technical leadership, cross-functional collaboration, and strategic oversight to influence future package designs and drive innovation in semiconductor technology
Job Summary
This role leads a specialized team to ensure successful introduction of advanced package technologies by mitigating chip-package interaction risks early.
The position requires defining robust characterization strategies and guiding critical engineering trade-offs to prevent field performance issues.
Success involves shaping next-generation technology by driving lessons learned into future designs and influencing industry practices through technical publications.
Matching Summary
Match Score: 85
The Sr. Manager of Package Design/Development Quality Assurance at Micron Semiconductor Asia Operations is responsible for leading an engineering team to address package technology challenges and ensure product reliability. This role combines technical leadership, cross-functional collaboration, and strategic oversight to influence future package designs and drive innovation in semiconductor technology.
Skills & Requirements
Must-have
10+ years packaging technology experience
Semiconductor package assembly knowledge
Thermomechanical stress analysis expertise
FMEA and 8D problem solving methods
Root cause analysis and closure skills
Nice-to-have
Technical publication and thought leadership
Cross-functional collaboration influence
Mentoring senior technical engineers
Continuous improvement culture building
Key Requirements
10+ years in Packaging Technology or Reliability Engineering
Strong knowledge of surface-mount processes
Experience with FMEA and structured problem-solving