Advanced Manufacturing Technician

GE Healthcare

Phoenix, United States
Wafer dicing and grinding processes
Advanced troubleshooting skills
Process optimization initiatives
The Dicing/Grinding Technician is responsible for executing and continuously improving wafer dicing and grinding processes

Job Summary

  • The Dicing/Grinding Technician is responsible for executing and continuously improving wafer dicing and grinding processes.
  • This role requires strong technical judgment, advanced troubleshooting skills, and the ability to work with minimal supervision.
  • GE HealthCare offers a great work environment, professional development, challenging careers, and competitive compensation.

Matching Summary

The Dicing/Grinding Technician is responsible for executing and continuously improving wafer dicing and grinding processes.

Skills & Requirements

Must-have

  • Wafer dicing and grinding processes
  • Advanced troubleshooting skills
  • Process optimization initiatives
  • Root cause investigations
  • Collaborate with engineering teams
  • Structured problem-solving techniques

Nice-to-have

  • Continuous improvement mindset
  • Minimal supervision work ethic
  • Technical communication influence
  • Proactive issue identification

Key Requirements

  • Associate degree or High School diploma with 3+ years technical experience
  • Troubleshoot at the system level
  • Interpret test data and diagnose deviations
  • Interpret and communicate complex technical information
  • Experience with computerized work systems
  • Work independently with minimal supervision

Work Rights

Legally authorized to work in the United States

Tailored Resume

Cover Letter