Physical Design (backend) Engineering Team Lead

Intel Retiree Medical Plan Trust

Petah-Tikva, Israel
Physical design backend implementation
Advanced node implementation methodologies
Physical signoff sta drc lvs
Lead a team of backend engineers in delivering high-performance, low-power chip designs using cutting edge process technologies

Job Summary

  • Lead a team of backend engineers in delivering high-performance, low-power chip designs using cutting edge process technologies.
  • Own and deliver physical signoff (STA, DRC, LVS, EMIR, IR-drop) with high quality and on schedule.
  • Mentor and grow a high-performing team of physical design engineers.

Matching Summary

Lead a team of backend engineers in delivering high-performance, low-power chip designs using cutting edge process technologies.

Skills & Requirements

Must-have

  • Physical design backend implementation
  • Advanced node implementation methodologies
  • Physical signoff STA DRC LVS
  • Industry-standard EDA tools
  • Lead physical design team

Nice-to-have

  • Cutting edge process technologies
  • Next-generation wireless products
  • Seamless integration and optimal performance
  • Resolve issues and optimize design flows

Key Requirements

  • 10+ years of experience in physical design
  • 2 years in a technical leadership role
  • Successful tapeouts in advanced FinFET nodes
  • B.Sc./M.Sc. in Electrical Engineering or related field

Work Rights

Not specified

Tailored Resume

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