Advanced Package And 3dic Solutions Director

Cadence

California, US
Base: $157,500 to $292,500; bonus/equity: incentiv...
Allegro package designer expert
3dic implementation flows
Package design experience
This position involves defining and leading the development of advanced packaging and 3DIC implementation flows for foundry and customer solutions

Job Summary

  • This position involves defining and leading the development of advanced packaging and 3DIC implementation flows for foundry and customer solutions.
  • The person that fills this position is expected to develop excellent working relationships with Cadence R&D and product engineering teams as well as customers.
  • Our benefits programs include: paid vacation and paid holidays, 401(k) plan with employer match, employee stock purchase plan, a variety of medical, dental and vision plan options, and more.

Matching Summary

This position involves defining and leading the development of advanced packaging and 3DIC implementation flows for foundry and customer solutions.

Salary

Base: $157,500 to $292,500; Bonus/Equity: Incentive compensation; Benefits: Paid vacation and paid holidays, 401(k) plan with employer match, employee stock purchase plan, medical, dental and vision plan options

Skills & Requirements

Must-have

  • Allegro Package Designer expert
  • 3DIC implementation flows
  • package design experience
  • 3D structures and designs
  • 3rd party packaging formats

Nice-to-have

  • customer-facing communication
  • continuous learning
  • problem-solving skills
  • chip level CMOS design concepts

Key Requirements

  • Minimum 20 years experience with package design
  • 10 years experience as an APD expert
  • Bachelor’s degree (Masters preferred) in Electrical or Electronics Engineering

Work Rights

Not specified

Tailored Resume

Cover Letter