The Senior Technical Application & Sales Engineer position at The Supreme HR Advisory in Admiralty, Singapore, requires a professional with extensive experience in semiconductor packaging and advanced technology processes. The role involves engaging with customers, troubleshooting bonding issues, and supporting technical sales activities
Job Summary
The role involves engaging semiconductor customers to understand packaging roadmaps, process requirements, and yield challenges.
Candidates will lead machine qualification activities including FAT and SAT while supporting customer buyoff and onsite qualification.
The position requires developing and optimizing TCB process parameters for advanced applications like 3D Packaging and Chiplet Integration.
Matching Summary
Match Score: 85
The Senior Technical Application & Sales Engineer position at The Supreme HR Advisory in Admiralty, Singapore, requires a professional with extensive experience in semiconductor packaging and advanced technology processes. The role involves engaging with customers, troubleshooting bonding issues, and supporting technical sales activities.
Salary
Base: SGD 7,000 – SGD 10,000/month; Bonus/Equity: Not specified; Benefits: Not specified
Skills & Requirements
Must-have
Thermo Compression Bonding (TCB) experience
Advanced packaging processes HBM CoWoS
Flip Chip process expertise
DOE and statistical analysis tools
Troubleshooting bonding issues
Machine qualification FAT SAT activities
Nice-to-have
Fluxless or N2 bonding environment knowledge
Experience in OSAT or IDM environments
Cross-functional team collaboration skills
Vision system and alignment accuracy understanding
Key Requirements
Bachelor's or Master's degree in Engineering or Materials Science
5-15 years of semiconductor packaging experience
Hands-on experience with TCB and Flip Chip processes