Base: $50,600.00-$67,500.00; bonus/equity: not spe...
Hybrid
Backside wafer processing
Cleanroom operations
Wire bonding processes
This role supports production and engineering priorities in a cleanroom environment, focusing on die preparation, hybridization, wicking, and wire bonding processes
Job Summary
This role supports production and engineering priorities in a cleanroom environment, focusing on die preparation, hybridization, wicking, and wire bonding processes.
The company offers a competitive salary and benefits package including health, dental, vision, and life insurance from day one, paid vacation, sick time, holidays, 401(k) with company match, employee stock purchase plan, and educational tuition reimbursement.
Applicants must be U.S. citizens, nationals, legal permanent residents, asylees, refugees, or eligible to obtain the appropriate export control license from the U.S. Departments of State or Commerce.
Matching Summary
This role supports production and engineering priorities in a cleanroom environment, focusing on die preparation, hybridization, wicking, and wire bonding processes.
Salary
Base: $50,600.00-$67,500.00; Bonus/Equity: Not specified; Benefits: Health, Dental, Vision, Life Insurance, Paid Vacation, 401(k) Match, Stock Purchase Plan, Tuition Reimbursement
Skills & Requirements
Must-have
backside wafer processing
cleanroom operations
wire bonding processes
hybridization tool operation
SPC chart maintenance
chemical handling
ISO Class 6 cleanroom protocols
Nice-to-have
teamwork and communication skills
attention to detail
manual dexterity for small components
experience with metrology tools
process parameter optimization
6S principles adherence
Key Requirements
High School Diploma or equivalent
1–2 years semiconductor assembly experience
familiarity with cleanroom operations
ability to read paper and digital travelers
must be U.S. citizen or authorized to work
ability to lift up to 25 lbs
Work Rights
Must have US citizenship or equivalent authorization