Principal Signal Power Integrity Engineer, Texas Institute For Electronics
The University of Texas at Austin
Austin, TX, US
Tie pyys industry-competitive salaries; not specif...
Hybrid
12+ years si/pi experience
Advanced packaging simulation tools
2.5d/3dic heterogeneous integration
The Texas Institute for Electronics is a transformative venture backed by $1.4 billion to advance 3D heterogeneous integration and chiplet-based architectures
Job Summary
The Texas Institute for Electronics is a transformative venture backed by $1.4 billion to advance 3D heterogeneous integration and chiplet-based architectures.
This role requires owning end-to-end signal and power integrity analysis for advanced packages, from initial architecture through final signoff.
Candidates will collaborate directly with EDA vendors and foundries to develop reference flows while mentoring junior engineers and guiding technical strategy.
Matching Summary
The Texas Institute for Electronics is a transformative venture backed by $1.4 billion to advance 3D heterogeneous integration and chiplet-based architectures.
Salary
TIE Pays Industry-Competitive Salaries; Not specified; Competitive health benefits (employee premiums covered at 100%); TRS retirement plan with matching
Skills & Requirements
Must-have
12+ years SI/PI experience
Advanced packaging simulation tools
2.5D/3DIC heterogeneous integration
High-speed interface standards expertise
Python/Tcl scripting automation
Nice-to-have
Multi-material package challenges
Thermo-mechanical co-simulation knowledge
Technical publications or patents
PDK/ADK design enablement experience
Standards body participation
Key Requirements
BS in Electrical Engineering or related field
12+ years hands-on SI/PI engineering experience
Deep expertise with Ansys HFSS/SIwave or Cadence Sigrity
Experience with PCIe Gen6/7, CXL, UCIe, HBM standards