Not specified (assumed on-site based on job location)
Bachelor's degree in engineering
5-8 years semiconductor ic manufacturing experience
Wafer bump process exposure
ON Semiconductor is seeking an External Manufacturing Engineer to oversee projects related to semiconductor manufacturing processes, focusing on cross-site consolidation and strategic program management. The ideal candidate will have extensive experience in semiconductor IC manufacturing and project leadership, with a strong emphasis on engineering principles
Job Summary
The role serves as the project leader for resilience, subcon consolidation, and dual source qualification initiatives within a mass production environment.
Candidates must lead cross-site functional core teams to ensure timely execution of outsourcing strategies and supplier performance milestones.
The position requires managing gap analysis, design checks, and risk management to achieve smooth qualification and robust process integration.
Matching Summary
Match Score: 85
ON Semiconductor is seeking an External Manufacturing Engineer to oversee projects related to semiconductor manufacturing processes, focusing on cross-site consolidation and strategic program management. The ideal candidate will have extensive experience in semiconductor IC manufacturing and project leadership, with a strong emphasis on engineering principles.
Skills & Requirements
Must-have
Bachelor's Degree in Engineering
5-8 years semiconductor IC manufacturing experience
Wafer Bump Process exposure
Assembly and Test process knowledge
Packaging experience required
Cross site-functional program management
Nice-to-have
Certified PMP preferred
Self-driven and disciplined approach
Strong technical writing skills
Experience with Change Control Board (CAB)
IATF 16949 requirements knowledge
Key Requirements
Bachelor's Degree in Engineering or equivalent
Minimum 5-8 years in semiconductor IC manufacturing
Hands-on exposure to Wafer Bump, Assembly, Test & Packaging
Track record in cross site-functional program management