This role involves leading technical engagement with global OSAT suppliers to ensure production readiness for next-generation FPGA and SoC products
Job Summary
This role involves leading technical engagement with global OSAT suppliers to ensure production readiness for next-generation FPGA and SoC products.
The engineer will drive new product introduction from engineering builds through volume manufacturing while optimizing packaging architectures for performance and cost.
Candidates must possess strong data-driven analysis skills to monitor backend yield performance and lead corrective actions for systemic issues.
Matching Summary
This role involves leading technical engagement with global OSAT suppliers to ensure production readiness for next-generation FPGA and SoC products.
Salary
Base: $159,700 - $230,000 USD equivalent hourly rate; Bonus/Equity: Not specified; Benefits: Not specified
Skills & Requirements
Must-have
10+ years semiconductor assembly experience
OSAT manufacturing environment expertise
Flip-chip BGA and substrate technologies
Yield optimization and root cause analysis
Supplier engagement and management
Nice-to-have
FPGA or SoC backend experience
Automotive high-reliability qualifications
Advanced packaging knowledge like 2.5D/3D
Supply chain risk mitigation strategies
Smart factory analytics familiarity
Key Requirements
Bachelor's degree in Electrical Engineering or related field
Minimum 10 years of semiconductor assembly/packaging/test experience
Eligibility for U.S. export authorizations
Work Rights
Must be eligible for required U.S. export authorizations