Ingénieur En Procédés D'assemblage Photonique / Photonics Assembly Process Engineer

Ciena Corporation

Base: $55,700 - $88,900 for bachelor's/master's; b...
Not specified
Bachelor's degree in engineering or materials science
Hands-on experience with photonics assembly processes
Knowledge of wafer bumping and flip chip bonding
Ciena Corporation is seeking a highly motivated Photonics Assembly Process Engineer to join their photonics component team, focusing on advanced manufacturing processes for telecommunications applications. The ideal candidate will have a background in engineering or a related field, with hands-on experience in photonics assembly processes and a passion for innovation

Job Summary

  • The role involves designing and optimizing assembly processes for photonic components used in high-speed communication networks from R&D through production.
  • Candidates will collaborate with multidisciplinary teams to ensure the scalability, reliability, and performance of cutting-edge telecommunication products.
  • Ciena offers a comprehensive benefits package including medical, dental, vision, 401(K) matching, and an Employee Stock Purchase Program.

Matching Summary

Match Score: 85

Ciena Corporation is seeking a highly motivated Photonics Assembly Process Engineer to join their photonics component team, focusing on advanced manufacturing processes for telecommunications applications. The ideal candidate will have a background in engineering or a related field, with hands-on experience in photonics assembly processes and a passion for innovation.

Salary

Base: $55,700 - $88,900 for Bachelor's/Master's; Base: $66,800 - $106,800 for PhD; Bonus: Discretionary incentive bonus eligible for non-sales employees

Skills & Requirements

Must-have

  • Bachelor's degree in Engineering or Materials Science
  • Hands-on experience with photonics assembly processes
  • Knowledge of wafer bumping and flip chip bonding
  • Experience with active alignment techniques
  • Strong analytical and problem-solving skills

Nice-to-have

  • Master's degree or PhD in relevant field
  • Passion for innovation and learning new technologies
  • Willingness to travel occasionally for supplier visits
  • Experience in semiconductor packaging
  • Ability to work in a cross-functional environment

Key Requirements

  • 0-5 years of industrial or research experience
  • Bachelor's degree in Mechanical Engineering, Physics, or Materials Science
  • Experience with statistical process control (SPC)

Work Rights

Not specified

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