Senior Program Manager

Intel Retiree Medical Plan Trust

Tokyo, Japan
Onsite
Advanced packaging substrate technology
Supplier capacity management
Process control system adherence
Work at the forefront of packaging technologies essential for next-generation AI devices

Job Summary

  • Work at the forefront of packaging technologies essential for next-generation AI devices.
  • Lead efforts to qualify new capacity at advanced packaging suppliers, ensuring timely readiness to meet growing customer demand.
  • Influence strategic decision-making at senior supplier management levels.

Matching Summary

Work at the forefront of packaging technologies essential for next-generation AI devices.

Skills & Requirements

Must-have

  • Advanced packaging substrate technology
  • Supplier capacity management
  • Process control system adherence
  • New factory startup micro-schedules
  • Onsite supplier engineering collaboration

Nice-to-have

  • Thrive on solving complex challenges
  • Challenge conventional approaches
  • Build lasting supplier partnerships
  • Flexibility to adapt to evolving project scopes

Key Requirements

  • 8+ years of experience (Bachelor's/Master's) or 4+ years (PhD) in Science or Engineering
  • 6+ years of experience in fab back-end or substrate manufacturing process development
  • Experience in capacity management
  • Experience in lead time analysis
  • Experience in yield improvement
  • Experience in structured problem solving
  • Experience in situational leadership
  • Experience in supplier influence
  • Experience in stakeholder management
  • Fluent business-level English communication skills
  • Excellent presentation abilities

Work Rights

Not specified

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