Principal / Senior Engineer, Process Engineering (advanced Packaging)

ASM

Hsinchu, Taiwan
On-site
D2w/w2w hybrid bonding experience
Thin-film deposition expertise ald cvd pecvd
Materials characterization techniques xps sims tem
ASM is seeking a Principal/Senior Engineer in Process Engineering with expertise in advanced packaging and thin-film deposition technologies to join their innovative team in Hsinchu, Taiwan. The role involves research and development of semiconductor processes and offers a collaborative work culture focused on diversity, inclusion, and sustainability

Job Summary

  • You will play a key role in advancing ASM's semiconductor process technologies by leveraging expertise in thin-film deposition and materials characterization.
  • The position involves designing complex experiments using DOE and RSM methodologies to develop new films for emerging packaging applications like W2W/D2W Hybrid bonding.
  • ASM values diversity, inclusion, and sustainability while offering development programs that support your growth and push the boundaries of innovation.

Matching Summary

Match Score: 85

ASM is seeking a Principal/Senior Engineer in Process Engineering with expertise in advanced packaging and thin-film deposition technologies to join their innovative team in Hsinchu, Taiwan. The role involves research and development of semiconductor processes and offers a collaborative work culture focused on diversity, inclusion, and sustainability.

Skills & Requirements

Must-have

  • D2W/W2W Hybrid bonding experience
  • Thin-film deposition expertise ALD CVD PECVD
  • Materials characterization techniques XPS SIMS TEM
  • DOE and RSM experimental design methodologies
  • 10 years combined education and work experience

Nice-to-have

  • Integration of CoWoS SoIC InFO process flows
  • Strong communication skills for technical concepts
  • Experience with equipment qualification data PLC
  • Mentorship capabilities for process engineers

Key Requirements

  • Bachelor's Master's or PhD in Chemical Engineering Materials Science Electrical Engineering or Physics
  • Minimum 10 years of experience in thin-film deposition and advanced packaging
  • Proficiency in electrical characterization techniques for CMOS devices

Work Rights

Not specified

Tailored Resume

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