Principal Dram Architect – Gpu Memory Solutions

NVIDIA

Base: $272,000 - $431,250 usd; bonus/equity: eligi...
**
15+ years dram or memory system architecture experience
5+ years focused on hbm2/2e/3/3e or next-gen
Expertise in tsv design, die stacking, and interposer integration
** NVIDIA is looking for a Principal DRAM Architect to lead the design and implementation of next-generation memory solutions for AI and graphics applications. The ideal candidate will have extensive experience in DRAM architecture, particularly with HBM technologies, and will play a key role in shaping industry standards and NVIDIA's product roadmap. **

Job Summary

  • This role sits at the intersection of I/O design, advanced packaging, and process technology to co-optimize DRAM, GPU, and system architectures.
  • Candidates will collaborate across domains on advanced packaging technologies such as CoWoS and hybrid bonding to optimize performance and yield.
  • The position offers a competitive base salary range of $272,000 - $431,250 USD along with equity and benefits.

Matching Summary

Match Score: 75

** NVIDIA is looking for a Principal DRAM Architect to lead the design and implementation of next-generation memory solutions for AI and graphics applications. The ideal candidate will have extensive experience in DRAM architecture, particularly with HBM technologies, and will play a key role in shaping industry standards and NVIDIA's product roadmap. **

Salary

Base: $272,000 - $431,250 USD; Bonus/Equity: Eligible for equity; Benefits: Generous benefits package included

Skills & Requirements

Must-have

  • 15+ years DRAM or memory system architecture experience
  • 5+ years focused on HBM2/2e/3/3e or next-gen
  • Expertise in TSV design, die stacking, and interposer integration
  • Deep understanding of HBM PHYs and high-speed interfaces
  • Proven participation in JEDEC standards organizations

Nice-to-have

  • Hands-on experience with GDDR6/7 and LPDDR5/6 architectures
  • Deep understanding of thermal and mechanical challenges in packaging
  • Familiarity with emerging memory technologies like MRAM or RRAM
  • Publications, patents, or JEDEC leadership roles
  • Background in high-bandwidth computing platforms for AI or HPC

Key Requirements

  • MS or PhD in Electrical Engineering, Computer Engineering, or Physics
  • 15+ years of experience in DRAM or memory system architecture
  • 5+ years of specific focus on HBM generations (HBM2/2e/3/3e)
  • Demonstrated ability to influence DRAM vendor roadmaps

Work Rights

Not specified

Tailored Resume

Cover Letter