Silicon integration understanding at backend package level
The role involves developing advanced packaging process solutions to ensure the success of new processes, equipment, and materials for Micron's products
Job Summary
The role involves developing advanced packaging process solutions to ensure the success of new processes, equipment, and materials for Micron's products.
Candidates must lead process readiness activities, improve yield and reliability through characterization, and manage risk mitigation prior to silicon arrival.
The position requires driving cross-functional collaboration to resolve process problems and define a strategy roadmap for future packaging capabilities.
Matching Summary
Match Score: 75
The role involves developing advanced packaging process solutions to ensure the success of new processes, equipment, and materials for Micron's products.
Skills & Requirements
Must-have
Frontend fab Process integration experience
Backend advance packaging wafer die level process
Silicon integration understanding at backend package level
Simulation tools and data analytics proficiency
Temporary permanent bonding technology knowledge
Nice-to-have
Strong project management skills for timeline execution
Cross functional team collaboration abilities
Creative problem solving for process constraints
Understanding of business needs and customer requirements
Key Requirements
PhD/Masters/Bachelor's in Engineering or Physics
6 years or more experience in semiconductor industry
Experience in Frontend fab or Backend advanced packaging
Proficiency with simulation tools and data analytics platforms