Packaging Research And Development Engineer

Inteelabs

Phoenix, Arizona, US
Base: $133,800.00-219,550.00 usd; bonus/equity: st...
Process and material development
Advanced substrate packaging technology
Factory floor operations
Join a world-class first-of-a-kind embedded die packaging facility and learn advanced substrate manufacturing know-how

Job Summary

  • Join a world-class first-of-a-kind embedded die packaging facility and learn advanced substrate manufacturing know-how.
  • Drive disruptive technology innovations and be part of creating history in the substrate packaging industry.
  • We offer a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and benefit programs.

Matching Summary

Join a world-class first-of-a-kind embedded die packaging facility and learn advanced substrate manufacturing know-how.

Salary

Base: $133,800.00-219,550.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • Process and material development
  • Advanced substrate packaging technology
  • Factory floor operations
  • Equipment and material supplier interaction
  • Statistical data analysis
  • Python or machine learning

Nice-to-have

  • Work with ambiguity and flexibility
  • Cross-functional team leadership
  • Disruptive technology innovation
  • Continuous process improvement

Key Requirements

  • PhD degree in relevant field
  • Minimum 3 months experience statistical data analysis
  • Minimum 3 months experience Python or machine learning
  • 1+ years experience engineering troubleshooting
  • 1+ years experience process tools SPC PCS RFCs
  • 1+ years experience JMP and JSL
  • 1+ years experience relevant science or engineering field

Work Rights

Not specified

Tailored Resume

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