Engineer, Process Development Engineering

Analog Devices Foundation

Penang, Malaysia
On-site
Die attach and flip chip processes
Semiconductor packaging
Process characterization and optimization
Analog Devices is seeking an Engineer for Process Development Engineering in Penang, Malaysia. The role focuses on developing and optimizing semiconductor packaging processes, particularly Die Attach and Flip Chip assembly, while supporting production and new product introduction

Job Summary

  • Develop, qualify, and optimize Die Attach and Flip Chip assembly processes for semiconductor packaging.
  • Provide process engineering support for production lines, including troubleshooting yield and quality issues.
  • Support new product introduction (NPI) and process transfer from development to high-volume manufacturing.

Matching Summary

Match Score: 85

Analog Devices is seeking an Engineer for Process Development Engineering in Penang, Malaysia. The role focuses on developing and optimizing semiconductor packaging processes, particularly Die Attach and Flip Chip assembly, while supporting production and new product introduction.

Skills & Requirements

Must-have

  • Die Attach and Flip Chip processes
  • Semiconductor packaging
  • Process characterization and optimization
  • New Product Introduction (NPI) support
  • Continuous improvement initiatives

Nice-to-have

  • Advanced packaging technologies
  • Equipment vendor interface
  • Reliability testing and failure analysis

Key Requirements

  • Bachelor’s or Master’s degree in Engineering or related field
  • 3–10 years of experience in semiconductor packaging or assembly
  • Hands-on experience with Die Attach and Flip Chip processes
  • Experience with die attach equipment (ASM, BESI, Datacon, etc.)

Work Rights

Not specified

Tailored Resume

Cover Letter