New College Grad - Wafer Bonding Process Development Engineer

Micron Technology

Boise, ID, United States
Wafer bonding process development
Process optimization
Root cause analysis
Micron Technology is a world leader in innovating memory and storage solutions

Job Summary

  • Micron Technology is a world leader in innovating memory and storage solutions.
  • You will work on state-of-the-art equipment and own the process roadmap.
  • Micron is dedicated to your personal wellbeing and professional growth.

Matching Summary

Micron Technology is a world leader in innovating memory and storage solutions.

Skills & Requirements

Must-have

  • Wafer bonding process development
  • Process optimization
  • Root cause analysis

Nice-to-have

  • Research and development environment
  • Strong analytical skills
  • Digital literacy

Key Requirements

  • MS in Chemical Engineering
  • Working knowledge in statistics
  • Basic knowledge of wafer bonding process

Work Rights

Not specified

Tailored Resume

Cover Letter