Sr Engineer, Die Design Engineering Aptd

Micron

Hyderabad, India
Hybrid
5+ years in die design
Expertise in eda tools
Experience with hbm and 3d-ic
Micron Technology is a leader in memory and storage solutions

Job Summary

  • Micron Technology is a leader in memory and storage solutions.
  • The role involves defining TSV placement strategy and collaborating with various engineering teams.
  • Candidates will contribute to advanced packaging technology roadmap discussions.

Matching Summary

Micron Technology is a leader in memory and storage solutions.

Skills & Requirements

Must-have

  • 5+ years in die design
  • Expertise in EDA tools
  • Experience with HBM and 3D-IC

Nice-to-have

  • Familiarity with chiplet architecture
  • Experience with layout automation scripting
  • Knowledge of reliability physics

Key Requirements

  • Masters or PhD in Electrical Engineering
  • Direct hands-on experience with advanced packaging programs
  • Proven experience with TSV-based die design

Work Rights

Not specified

Tailored Resume

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