2026 Intern - Packaging Engineer

NXP USA INC.

Ic packaging technology research
New packaging technology development
Global team communication skills
This position focuses on IC packaging technology research and development within a global team environment

Job Summary

  • This position focuses on IC packaging technology research and development within a global team environment.
  • The intern will coordinate and lead development projects independently while collaborating across US, Europe, Malaysia, Japan, and France.
  • Responsibilities include new package process development, advanced material interface studies, and failure analysis.

Matching Summary

This position focuses on IC packaging technology research and development within a global team environment.

Skills & Requirements

Must-have

  • IC packaging technology research
  • New packaging technology development
  • Global team communication skills

Nice-to-have

  • Advanced material interface study
  • Independent project leadership
  • Cross-cultural cooperation experience

Key Requirements

  • Pursuing bachelor or master degree
  • Major in Metallic Materials Engineering
  • Major in Polymer Materials Engineering
  • Major in Mechanical Engineering and Automation
  • Good oral and written English communication

Work Rights

Not specified

Tailored Resume

Cover Letter