Base: $87,100.00 - $157,450.00; bonus/equity: not ...
Electronics packaging designs
3d modelling
Thermal management
Support applied research and engineering development of solutions and products in across various projects for land-based, airborne, and/or space applications
Job Summary
Support applied research and engineering development of solutions and products in across various projects for land-based, airborne, and/or space applications.
Work closely with the science and manufacturing departments to facilitate transition of innovative technology from the research stage to full production.
We're not hiring followers. We're recruiting the ones who disrupt, provoke, and refuse to fail.
Matching Summary
Support applied research and engineering development of solutions and products in across various projects for land-based, airborne, and/or space applications.
Salary
Base: $87,100.00 - $157,450.00; Bonus/Equity: Not specified; Benefits: Not specified
Skills & Requirements
Must-have
electronics packaging designs
3D modelling
thermal management
SolidWorks
FEA and CFD concepts
cross functional development teams
hands-on with hardware
Nice-to-have
advanced electronics packaging
chip-centric cooling techniques
miniaturized electrical/mechanical components
rapid prototyping techniques
airborne and satellite payload systems
Key Requirements
B.S. degree in Mechanical Engineering or related field
at least 4 years of experience
Secret Security Clearance
ability to obtain Top Secret Security Clearance
Masters degree in Mechanical Engineering or related field