Pmts Silicon Photonics Packaging Integration

GlobalFoundries

$131,900.00 - $241,500.00 py
Hybrid
Silicon photonics packaging
Optical packaging architectures
Fiber-to-chip coupling strategies
Lead the development and sustainment of advanced optical packaging solutions for silicon photonics and co-packaged optics platforms

Job Summary

  • Lead the development and sustainment of advanced optical packaging solutions for silicon photonics and co-packaged optics platforms.
  • Collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures.
  • Own the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.

Matching Summary

Lead the development and sustainment of advanced optical packaging solutions for silicon photonics and co-packaged optics platforms.

Salary

$131,900.00 - $241,500.00

Skills & Requirements

Must-have

  • Silicon Photonics packaging
  • Optical packaging architectures
  • Fiber-to-chip coupling strategies
  • Heterogeneous integration (HI)
  • Multiphysics simulations
  • Root cause analysis for yield issues

Nice-to-have

  • Automated optical test setups
  • Co-packaged optics (CPO) knowledge
  • Thermal/mechanical modeling expertise
  • Cross-functional team leadership

Key Requirements

  • Master's degree or higher
  • 15+ years semiconductor packaging experience
  • Hands-on fiber attach experience
  • Experience bringing products to production
  • Strong English communication skills

Work Rights

Not specified

Tailored Resume

Cover Letter