Physical failure analysis (PFA) involves the localisation, imaging, and characterisation of manufacturing defects in our products
Job Summary
Physical failure analysis (PFA) involves the localisation, imaging, and characterisation of manufacturing defects in our products.
Analysts will be expected to utilise a wide variety of fault localisation and imaging tools/techniques, including but not limited to Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), Energy Dispersive X-ray Spectroscopy (EDX), Focused Ion Beam (FIB), SEM-based Nanoprober.
Document findings in professional reports to be shared with various stakeholders and collaborate with cross-departmental teams such as Customer Quality Engineering, Manufacturing, and other FA labs.
Matching Summary
Physical failure analysis (PFA) involves the localisation, imaging, and characterisation of manufacturing defects in our products.
Skills & Requirements
Must-have
Scanning Electron Microscope (SEM)
Focused Ion Beam (FIB)
Energy Dispersive X-ray Spectroscopy (EDX)
Transmission Electron Microscope (TEM)
SEM-based Nanoprober
Utilise fault localisation and imaging tools
Nice-to-have
Strong problem solving skills
Attention to detail
Good communication skills
Produce quality results timely
Key Requirements
Bachelor's or Master's degree
Not more than 2 years’ work experience
Basic technical knowledge of semiconductor physics
MOSFET operations knowledge
Able to work with chemicals, X-Ray, Electron and Ion Beam tools
Comfortable with handling small and delicate samples