Test Module Development Engineer

Intel Retiree Medical Plan Trust

Phoenix, Arizona, United States
Base: $133,800.00-188,890.00 usd; bonus/equity: st...
Onsite
Bachelor's degree in engineering or related stem field
6+ years of electrical test-related experience
Application of statistical controls and doe methodologies
This role focuses on advancing Moore's Law through cutting-edge packaging technologies for high-performance computing and AI applications

Job Summary

  • This role focuses on advancing Moore's Law through cutting-edge packaging technologies for high-performance computing and AI applications.
  • The engineer will execute pathfinding activities to support the Intel Foundry advanced packaging roadmap while optimizing production output.
  • Intel offers a competitive total compensation package including stock bonuses and comprehensive health and retirement benefits.

Matching Summary

This role focuses on advancing Moore's Law through cutting-edge packaging technologies for high-performance computing and AI applications.

Salary

Base: $133,800.00-188,890.00 USD; Bonus/Equity: Stock bonuses included; Benefits: Health, retirement, and vacation programs

Skills & Requirements

Must-have

  • Bachelor's degree in engineering or related STEM field
  • 6+ years of electrical test-related experience
  • Application of statistical controls and DOE methodologies

Nice-to-have

  • Prior work with semiconductor package design
  • Project management for time-critical technical projects
  • Excellent verbal and written communication skills

Key Requirements

  • Bachelor's degree with 6+ years experience OR Master's with 4+ years OR Ph.D.
  • Experience with FMEA and/or DOE methodologies
  • Regular onsite presence required in Phoenix, Arizona

Work Rights

Not specified

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