Package Design Engineer

Teledyne e2v

Saint-Egrève, France
Microelectronics packaging design flow
Package layout with cadence apd
Signal and power integrity
The Package Design Engineer leads the complete design flow of advanced microelectronic packages, translating customer needs into technical specifications and ensuring successful routing and design reviews

Job Summary

  • The Package Design Engineer leads the complete design flow of advanced microelectronic packages, translating customer needs into technical specifications and ensuring successful routing and design reviews.
  • As the key technical interface, the Package Design Engineer works closely with packaging vendors and assembly houses throughout the project lifecycle, monitoring emerging technologies and leading R&D initiatives.
  • Teledyne e2v offers the opportunity to work on cutting-edge technological projects, join an innovation-driven environment, and build a career through multiple development paths within the Teledyne group.

Matching Summary

The Package Design Engineer leads the complete design flow of advanced microelectronic packages, translating customer needs into technical specifications and ensuring successful routing and design reviews.

Skills & Requirements

Must-have

  • Microelectronics packaging design flow
  • Package layout with Cadence APD
  • Signal and power integrity
  • Technical interface with vendors
  • Electrical and thermal simulations

Nice-to-have

  • Customer focused and team player
  • Ability to adapt and communicate
  • Autonomy and continuous improvement
  • Innovation-driven environment
  • Work-life balance

Key Requirements

  • First confirmed experience in packaging design
  • Mastering packaging layout
  • Knowledge basic mechanical design
  • Experience in technical management of vendors
  • Good level of English (B2 minimum)

Work Rights

Not specified

Tailored Resume

Cover Letter