Substrate / Advanced Packaging Manager

TSMC

Taiwan
On-site
Master's or ph.d. in engineering
15+ years advanced packaging experience
Substrate design expertise
TSMC is seeking a Substrate / Advanced Packaging Manager to lead initiatives in 3DIC and advanced packaging design. The ideal candidate will possess extensive experience in semiconductor physics and advanced packaging technologies, focusing on innovative solutions for complex substrate and packaging challenges

Job Summary

  • This role supports TSMC's leadership in 3DIC and advanced packaging by extending expertise beyond chip-level design into packaging-level integration.
  • The position requires strong design and technology expertise to define future customer requirements, focusing on integrated packaging, dielectric parameters, and high-speed I/O.
  • Success metrics include providing impactful, data-driven suggestions that influence design direction and establishing trust with global teams.

Matching Summary

Match Score: 85

TSMC is seeking a Substrate / Advanced Packaging Manager to lead initiatives in 3DIC and advanced packaging design. The ideal candidate will possess extensive experience in semiconductor physics and advanced packaging technologies, focusing on innovative solutions for complex substrate and packaging challenges.

Skills & Requirements

Must-have

  • Master's or Ph.D. in Engineering
  • 15+ years advanced packaging experience
  • Substrate design expertise
  • Warpage and thermal modeling
  • EDA tools proficiency
  • High-speed I/O integration

Nice-to-have

  • Machine learning for design optimization
  • Patents in substrate domains
  • Multi-physics analysis skills
  • Reliability and IR/EM knowledge
  • Mentoring junior engineers

Key Requirements

  • Master's or Ph.D. degree required
  • 15+ years hands-on experience
  • Expertise in semiconductor physics
  • Strong problem-solving in ambiguous domains

Work Rights

Not specified

Tailored Resume

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