Senior Process Engineer - Dry Etch

Intel

Hillsboro, Oregon, US
Base: $155,520.00-298,440.00 usd; bonus/equity: st...
Hybrid
Sub-3nm gate-all-around fets
Front-end dry etch processing
Cmos device engineering
This role focuses on Integration and Device engineering across various Intel technologies, including 18A, to serve our global foundry customer base

Job Summary

  • This role focuses on Integration and Device engineering across various Intel technologies, including 18A, to serve our global foundry customer base.
  • The position requires extensive hands-on experience with sub-3nm Gate-All-Around (GAA) FETs and front-end dry etch processing.
  • Intel offers an exceptional opportunity to work with cutting-edge technology in a collaborative and innovative environment.

Matching Summary

This role focuses on Integration and Device engineering across various Intel technologies, including 18A, to serve our global foundry customer base.

Salary

Base: $155,520.00-298,440.00 USD; Bonus/Equity: stock bonuses; Benefits: health, retirement, and vacation

Skills & Requirements

Must-have

  • sub-3nm Gate-All-Around FETs
  • front-end dry etch processing
  • CMOS device engineering
  • device physics
  • logic architecture
  • interconnect development

Nice-to-have

  • foundry customer engineering
  • foundry New Product Introduction
  • complex tape-out troubleshooting
  • theoretical simulations
  • practical engineering methods
  • vendor ecosystem collaboration

Key Requirements

  • 7+ years hands-on experience
  • Bachelor's degree in STEM
  • Direct etch experience
  • Knowledge of DOE principles
  • Semiconductor foundry experience

Work Rights

Not specified

Tailored Resume

Cover Letter