We are hiring Module Engineers (Process / Equipment) to support advanced semiconductor wafer fabrication in a high-volume manufacturing environment. This role focuses on Diffusion, Ion Implantation, Etch, or Thin Film deposition processes, ensuring stable tool performance, high yield, and continuous process improvement. This is an excellent opportunity for engineers with semiconductor manufacturing, wafer fabrication, process engineering, or equipment engineering experience to grow in a leading global semiconductor company. Key Responsibilities Support daily semiconductor wafer fabrication operations within assigned module (Diffusion / Implant / Etch / Thin Film) Perform process monitoring, equipment troubleshooting, and root cause analysis (RCA) Drive yield improvement, defect reduction, and process optimization initiatives Execute statistical process control (SPC), data analysis, and process capability monitoring Support equipment qualification, preventive maintenance (PM), and tool recovery Collaborate with Process Integration, Manufacturing, and Equipment Engineering teams Participate in continuous improvement (CI), lean manufacturing, and cost reduction projects Ensure compliance with safety, cleanroom protocol, and semiconductor quality standards Requirements: Degree / Diploma in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or related discipline Experience in semiconductor manufacturing / wafer fabrication environment preferred Exposure to Diffusion, Ion Implant, Etch, or Thin Film processes is highly advantageous Knowledge of SPC, DOE, 8D, RCA, or yield management tools Strong analytical, troubleshooting, and problem-solving skills Familiar with cleanroom operations and high-volume manufacturing (HVM) environment Good team player with strong communication skills Willing to work in shift rotation (if required) How to apply: Interested candidates, kindly email updated resume to xiaoyee@wanco-manpower.com with