Internship: Electro/thermo Migration Reliability Capabilities Of Ic Packages

NXP Semiconductors

Full-time internship (40 hours per week)
Affinity with semiconductor and reliability
Team player in multi-disciplinary teams
Excellent communication skills in english
NXP Semiconductors is seeking a highly motivated Master of Science student for a full-time internship focused on electro-thermo migration reliability capabilities of IC packages. The role involves developing testing methods and understanding degradation mechanisms of IC packages under high temperature and current conditions, contributing to the company's quality and reliability objectives

Job Summary

  • This internship offers a great opportunity to develop your technical and soft skills.
  • You will gain experience in a multinational and diverse environment.
  • The role contributes directly to NXP's objectives in quality and reliability.

Matching Summary

Match Score: 85

NXP Semiconductors is seeking a highly motivated Master of Science student for a full-time internship focused on electro-thermo migration reliability capabilities of IC packages. The role involves developing testing methods and understanding degradation mechanisms of IC packages under high temperature and current conditions, contributing to the company's quality and reliability objectives.

Skills & Requirements

Must-have

  • Affinity with semiconductor and reliability
  • Team player in multi-disciplinary teams
  • Excellent communication skills in English

Nice-to-have

  • Flexible and able to multi-task
  • Experience in multinational environment
  • Willingness to work on real assignments

Key Requirements

  • Internship for Master of Science in Microelectronics
  • Registered as a student during the internship

Work Rights

Not specified

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