Module Development Engineer- Hybrid Bonding

Intel

Hillsboro, Oregon, US
Base: $99,030.00-139,810.00 usd; bonus/equity: sto...
Onsite
Equipment maintenance and repair
Continuous improvement of equipment and process
Process development for high volume
Embark on a journey of growth and transformation creating exceptionally engineered technology and bringing AI everywhere

Job Summary

  • Embark on a journey of growth and transformation creating exceptionally engineered technology and bringing AI everywhere.
  • As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision.
  • We offer a total compensation package that ranks among the best in the industry, including competitive pay, stock, bonuses, and comprehensive benefit programs.

Matching Summary

Embark on a journey of growth and transformation creating exceptionally engineered technology and bringing AI everywhere.

Salary

Base: $99,030.00-139,810.00 USD; Bonus/Equity: stock, bonuses; Benefits: health, retirement, vacation

Skills & Requirements

Must-have

  • Equipment maintenance and repair
  • Continuous improvement of equipment and process
  • Process development for high volume
  • New Product Introduction ownership
  • Excursion prevention systems development
  • Onsite work in Hillsboro, OR

Nice-to-have

  • Adaptability and attention to detail
  • Eagerness to learn and adapt
  • Collaboration and innovation
  • Drive for results and quality

Key Requirements

  • MS Degree in STEM field
  • Experience with database and analysis tools
  • Technical knowledge in SPC, DOE, FMEA
  • Up to 2 years relevant experience

Work Rights

Not specified

Tailored Resume

Cover Letter